Study on laser ablation of glass using MHz-to-GHz burst pulses

The authors report on the use of a burst-mode ultrashort pulsed laser source with an emitting wavelength 1030 nm to micro-machining plane areas glass different pulse durations, burst energies, and number sub-pulses per intra-burst rates 65 MHz 2.5 GHz. In investigated parameter range, maximum specific removal are obtained $$11.2\,\upmu \text{m}^{3}/\upmu \text{J}$$ for bursts $$27.0\,\upmu GHz bursts, being up four times higher compared non-burst regime. depth scan surface roughness increase at energies burst, respectively. Furthermore, significant difference in resulting topography between is shown by SEM images, mainly depending burst.